Device carrier assemblies

ABSTRACT

An apparatus comprising: a drive carrier assembly (DCA) including; an energy storage device having at least a portion thereof encased by a housing; and a printed circuit assembly to detect a power failure of a host computing device, wherein the printed circuit assembly has a first portion coupled to the energy storage device and a second portion coupled to a backplane of the host computing device

BACKGROUND

Devices may be connected to a computing device to provide additionalmemory and/or energy storage to the computing device. Some devices maybe hot-plugged or hot-swapped into the computing device while thecomputing device is in an operational state.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an apparatus including an energy storagedevice, according to an example;

FIG. 2 is another schematic view of an apparatus including an energystorage device, according to an example;

FIG. 3 is another schematic view of an apparatus including a memorydevice co-packaged with an energy storage device, according to anexample;

FIG. 4 is another schematic view of an apparatus including a printedcircuit assembly, according to an example;

FIG. 5 is a block diagram of a system including a drive carrierassembly, according to an example;

FIG. 6 is another schematic view of an apparatus including an energystorage device, according to an example;

FIGS. 7A and 7B are schematic views of two apparatus in two differentconfigurations, according to an example;

FIGS. 8A and 8B are schematic views of a system with two apparatus intwo different configurations, according to an example; and

FIG. 9 is another block diagram of a system including a drive carrierassembly, according to an example.

DETAILED DESCRIPTION

A device may be connected to a computing device to provide additionalmemory and/or energy storage to the computing device. For example, adevice such as a drive carrier assembly (DCA), which can include back-upenergy devices and/or back-up memory devices and may be connected to acomputing device to provide additional energy storage, and/or additionalmemory, display adapters, audio chipsets, graphics processing units,data storage, and/or memory card readers, among other functionalities tothe computing device.

As used herein, a “drive carrier assembly” is a device that may beutilized to package or co-package auxiliary electronic devices toconnect to a computing device. For example, a drive carrier assembly maybe a structure that is designed to contain electronic devices connectedto a computing device (e.g., a host computing device). Examples of drivecarrier assemblies include frames, carriers, modified drive bays, and/orchassis to mount docking stations, batteries, and/or other energystorage devices, hard drives and/or other memory devices, etc., whichmay be inserted into and/or removed from a computing device. Forexample, the drive carrier assembly may co-package the electronicdevices to be connected to a computing device such as a laptop computer,desktop computer, tablet, phablet, convertible laptop, smartphone,server (e.g., blade server), etc. In another example, the drive carrierassembly may be a small form factor carrier (for example, a 2.5 inchform factor carrier), a large form factor carrier (for example, a 3.5inch form factor carrier), a carrier half the width of a small formfactor carrier, a carrier half the width of a large form factor carrier,or some other size carrier.

The drive carrier assembly may co-package multiple devices. As usedherein, “co-package” means that one or more devices may be packagedtogether into one drive carrier assembly (DCA). For example, a DCA maybe co-packaged to include two electronic devices such as an energystorage device and a memory device to connect to a host computing devicevia a drive bay. In the preceding example, the battery and the memorydevice may be co-packaged such that they may connect to the hostcomputing device through individual connectors and/or ports. Forexample, when the battery and the memory device are co-packaged in thedrive carrier assembly and subsequently inserted into a bay of the hostcomputing device, the battery may connect to the computing devicethrough a port (e.g. a first port) and the memory device will connect tothe host computing device through a different port (e.g. a second port).In another example, the DCA may include one device, such as the energystorage device.

In some approaches, back-up energy cells may be located in internalportions of the computing device and/or in high-temperature areas of thecomputing device. For example, a blade server may have back-up powerthat is located internally such that the server may have to bedismantled to service the back-up energy cells thus involving the systemto be shut down and/or be powered off. After the shut down/power off,the energy device may be replaced, serviced, and/or installed, and thecomputing device may be powered back to an operational state.

In some approaches, back-up energy cells within removable batterydevices may not be hot plugged into the computing system (e.g.,removable battery devices that may not be connected to the computingsystem during runtime of the computing system) in part due to thelocation of the removable battery device (for example, located on amotherboard and/or closer towards the rear of a computing system), thusthe runtime of the host computing device may be interrupted to replaceand/or service a back-up memory device and/or a back-up energy storagedevice.

In contrast, examples herein may allow for replacement, service, and/orinstallation of back-up memory device, and/or back-up energy storagedevice during runtime of the computing device. This may allow forback-up memory, and/or back-up energy storage devices to be hotpluggable or hot swappable devices to be installed, removed and/orserviced without having to reboot or shut down the computing device,which may allow for less computing device downtime, less powerconsumption due to a reduced number of reboot operations to thecomputing device, and/or a more streamlined end user computingexperience as opposed to some previous approaches.

For example, the back-up memory device and/or back-up energy storagedevice may be packaged or co-packaged in a DCA to be accessible from afront portion of a host computing device. As used herein, “frontportion” refers to a portion of the computing device that is reachableto service, install, insert, and/or remove electrical components withouthaving to dismantle the computing device to access said components. Forexample, the front portion of the host computing device may be an areaof the host computing device that is reachable from an externallyaccessible vantage point. Additionally, in this example, the externalaccessibility at the front portion of the host computing device may be alow-temperature thermal environment for the co-packaged back-up memorydevice and/or back-up energy storage device. In some examples, thelow-temperature thermal environment may increase efficiency andoperability of the back-up memory device and/or back-up energy storagedevice packaged or co-packaged in the drive carrier assembly.

For example, a back-up memory device and/or back-up energy storagedevice may be package or co-packaged in a drive carrier assembly to beaccessible from the front portion of a host computing device. In thisexample, the accessibility from the front portion of the host computingdevice positions the drive carrier assembly in an area of the hostcomputing device that is a low-temperature when compared to thepreviously mentioned internal portions of the host computing device. Inaddition, the terms “low-temperature” and “high-temperature” as usedherein are intended to describe thermal temperatures of portions of thehost computing device relative to a different portion of the hostcomputing device, and should not be taken in a limiting sense.

The figures herein follow a numbering convention in which the firstdigit corresponds to the drawing figure number and the remaining digitsidentify an element or component in the drawing. For example, referencenumeral 100 may refer to element “00” in FIG. 1 and an analogous elementmay be identified by reference numeral 200 in FIG. 2. Elements shown inthe various figures herein can be added, exchanged, and/or eliminated soas to provide a number of additional examples of the disclosure. Inaddition, the proportion and the relative scale of the elements providedin the figures are intended to illustrate the examples of thedisclosure, and should not be taken in a limiting sense.

FIG. 1 is a schematic view of an apparatus including an energy storagedevice, according to an example. The apparatus 100 may include an energystorage device 102, a printed circuit assembly 104 having a firstportion 106 and a second portion 108. The energy storage device 102 insome examples may be a battery, capacitor, or super capacitor.

In an example, the energy storage device 102 may be an electric battery.As used herein, the term “battery” may refer to a device used to power,or store energy to power a different electrical or mechanical device.The energy storage device 102 may comprise a plurality of cells and/orcapacitors. For example, the plurality of cells may be electrochemicalcells with connections to power other electronic devices. As usedherein, the term “cell” refer to a battery cell of the plurality ofcells within the battery and may be that of a wet cell, a reserve cell,and/or a dry cell, other types of battery cell may be used, and theseexamples should not be taken in a limiting sense.

The printed circuit assembly 104, of the apparatus 100 iscommunicatively coupled to the energy storage device 102 by a firstportion 106 and may commutatively couple to a port of a host computingdevice utilizing a second portion 108. As used herein, the term “printedcircuit assembly” refers to a device to mechanically support andelectronically connect electronic components and/or electric components.In some examples, the printed circuit assembly may be soldered to thecomponents.

For example, the printed circuit assembly 104 may be a circuit boardincluding circuitry to regulate the plurality of cells within the energystorage device 102. In some examples, the printed circuit assembly 104may connect to a backplane and/or a port of the host computing device bythe second portion 108 (discussed further in conjunction with FIG. 5)and connect to the energy storage device 102 by the first portion 106.In some examples the host computing device may be a server. The printedcircuit assembly 104 may detect a power failure of the host computingdevice and regulate the plurality of cells of the energy storage device102 in response to the detected power failure. In another example, theprinted circuit assembly 104 may regulate charging of the energy storagedevice 102 while the host computing device is powered on.

FIG. 2 is another schematic view of an apparatus including an energystorage device, according to an example. The apparatus 200 may includethe energy storage device 202, the printed circuit assembly 204 havingthe first portion 206 and the second portion 208, and a housing 210. Theenergy storage device 202, in some examples, may be a battery,capacitor, or super capacitor, where at least a portion of the battery,capacitor, or super capacitor is encased by housing 210.

As shown in FIG. 2, the housing 210, may encase at least a portion ofenergy storage device 202. The housing 210 may be designed to protectthe energy storage device 202 from damage. The housing 210 may be madeof various suitable materials. For example, the housing 210 may be madeof metal, metal alloys, polymers, thermoplastics, and/or other suitablematerials. In some examples, the housing 210 may be substantially ofdimensions suitable to encase the energy storage device 202 such thatthe housing 210 may co-package with a second device into a drive carrierassembly, discussed further in conjunction with FIGS. 3 and 4.

As used herein, the term “substantially” intends that the characteristicis close enough to an ideal characteristic so as to achieve the value ofthe characteristic. For example, the dimensions of the housing 210 maybe different than that of the energy storage device 202, but closeenough to allow for the intended function of co-packaging the energystorage device 202 with a second device to be achieved.

As illustrated in FIG. 2, the housing 210 of the apparatus 200 mayencase at least a portion of energy storage device 202. As used herein,the term “encase” means a cover to wrap the exterior portion of theenergy storage device 202, the housing 210 may be made of a materialintended to protect and/or provide a uniform structure to facilitate theco-packaging of the energy storage device within a DCA, such as DCA 312illustrated and described in conjunction with FIG. 3.

The housing 210, illustrated in FIG. 2 may also provide an attachmentand/or a fastener to couple the energy storage device 202 to a seconddevice. As used herein, a “fastener” is a mechanism to secure anapparatus, device and/or other structure to a different structure. Afastener may be a clip, a pin, a snap or any equivalent mechanism toachieve securely fastening one structure to another structure. Forexample, the housing 210 may partially encase at least a portion of theenergy storage device 202 while the printed circuit assembly 204 remainsexposed, and the housing 210 may further couple to the top portion ofthe DCA to allow space for a second device, such as a memory device,thus co-packaging both devices into a single unit DCA. In some examples,this may allow the second portion 208 to commutatively couple to abackplane of a host computing device.

FIG. 3 is another schematic view of an apparatus including a memorydevice co-packaged with an energy storage device, according to anexample. The apparatus 300 may include the energy storage device 302,the printed circuit assembly 304 having the first portion 306 and thesecond portion 308, the housing 310, a DCA 312, a memory device 314, afirst end of the DCA 316, and a second end of the DCA 318.

The memory device 314 may include volatile memory (e.g., RAM, DRAM,SRAM, EPROM, EEPROM, etc.) and/or non-volatile memory (e.g., a HDD, astorage volume, data storage, etc.) In some examples, the memory device314 may be used as a back-up memory device in the event of a power lossexperienced by the host computing device.

As illustrated in FIG. 3, the memory device 314 co-packages the energystorage device 302 and the housing 310 into the DCA 312 such that theDCA 312 is moveable as a single unit. For example, as discussed furtherin conjunction with FIG. 5, the energy storage device 302, housing 310,and memory device 314 are co-packaged together into the DCA 312 suchthat all of the components may be inserted into a bay of a hostcomputing device as a single unit. Continuing with the previous example,the first end of the DCA 316 may facilitate the memory device 314coupling to a port and/or a backplane of the host computing device andthe second portion 308 of the printed circuit assembly tocommunicatively couple to a separate port and/or backplane of the hostcomputing device.

For example, when a host computing device is communicatively coupled tothe DCA 312, and experiences a loss of power, the second portion 308 ofthe printed circuit assembly 304 may communicate with the energy storagedevice 302 to regulate a plurality of cells within the energy storagedevice 302 to power a host computing device and/or memory device 314.Continuing with this example, the host computing device may facilitatethe transfer of data stored in volatile memory associated with the hostcomputing device to non-volatile memory associated with the memorydevice 314 in response to detection of the power loss.

As illustrated in FIG. 3, the memory device 314 co-packages the energystorage device 302 and the housing 310 into the DCA 312. As describedherein, the co-packaged DCA 312 may be hot pluggable when inserted intoa bay of a host computing when the computing device is in an operationalstate (e.g. device during runtime of a host computing device.) Forexample, the co-packaged DCA 312 may be coupled to a backplane of thehost computing device while the host computing device is running suchthat the memory device 314 and the energy storage device 302 areoperable without rebooting the computing device. In some examples, theDCA 312 may be connected to the host computing device during runtime ofthe host computing device, but may not be connected to the hostcomputing device prior to runtime of the host computing device. Thesefeatures are discussed further in conjunction with FIG. 5.

FIG. 4 is another schematic view of an apparatus including a printedcircuit assembly. The apparatus 400 may include the printed circuitassembly 404 having the first portion 406 and the second portion 408,the housing 410, the DCA 412, the first end of the DCA 416, and thesecond end of the DCA 418.

In some examples, the second end 418 of the DCA 412 is accessible from afront portion and/or an exterior of the host computing device. Forexample, a user and/or a machine may wish to install, service, and/orremove the DCA 412 from the host computing device. Continuing with thisexample, the second end 418 of the DCA 412 may be accessed from theexterior of the host computing device such that the DCA 412 may beinstalled and/or removed without disassembling the host computing deviceto gain access to an interior portion.

In some examples, the second end 418 of the DCA 412 may be secured tothe host computing device by at least one snap and/or an equivalentremovable fastener (not explicitly shown in FIG. 4). For example, a userand/or a machine may couple (e.g. to install the DCA 412) and/ordecouple (e.g. to remove the DCA 412) utilizing the at least one snap,fastener, or button. In this example, the user and/or the machine mayremove the DCA 412 by removing the at least one snap or equivalentfastener securing the second end 418 of the DCA 412 such that the DCA412 may be removed from the host computing device. Accordingly, at leastone snap and/or fastener may be coupled to the second end 418 of the DCA412 to install the DCA 412 to into the computing device, in the samefashion as the preceding example. In another example, the button may belocated at one side of the second end 418. A user may depress thebutton, actuating a lever (In other words, a lever may pop-out from thesecond end). Further, a user may install or couple the DCA 412 bypushing the second end 418 into the server. In the preceding examples,the installation and removal utilizing the at least one snap and/orfastener may be accomplished without the use of tools.

In some examples, the second end 418 of the DCA 412 may include anindication mechanism. For example, when the first end 416 of the DCA 412is inserted into the backplane of a host computing device, a mechanismmay provide an indication that the second portion 408 of the printedcircuit assembly 404 and an energy storage device such as 302 shown inFIG. 3 are communicatively coupled to the backplane. In some examples,the indicator mechanism may be an LED and/or a light (not explicitlyshown). For example, the LED and/or light may be illuminated the DCA 412is coupled to the host computing device and/or is in operation.

In some examples, the second end 418 of the DCA 412 may include one ormore fasteners to secure the DCA 412 in place. For example, the DCA 412may be inserted into a bay of a host computing device during a runtimeof a host computing device without interrupting the runtime, onceinserted the DCA 412 may be secured in place by at least one fastener(not explicitly shown). The DCA 412 may be removed and/or ejected inthis described manner utilizing fasteners coupled to second end 418. Forexample, DCA 412 may be decoupled from the backplane of a host computingdevice during runtime of the host computing device without interruptingthe runtime.

FIG. 5 is a block diagram of a system including a drive carrierassembly, according to an example. System 501 illustrates a server 520,a bay 522, a backplane 524, the DCA 512, the energy storage device 502,the printed circuit assembly 504, and the memory device 514. In someexamples, the server 520 may be a host computing device similar to thosedescribed in the preceding examples.

The server 520 includes the bay 522 to receive the DCA 512 andcommunicatively couple the DCA 512 to the backplane 524 of the server520. The DCA 512 is co-packaged to include the memory device 514, theenergy storage device 502, which may be partially encased by a housingthat may be coupled to a portion of the DCA 512, and the printed circuitassembly 504, which may be coupled to the energy storage device 502 toregulate the use of the energy storage device 502 in response toreceiving a signal from the server 520 that the system 501 hasexperienced a power failure.

In some examples, the energy storage device 502 may be co-packaged inthe DCA 512 such that the memory device 514 is positioned below theenergy storage device 502 relative to the DCA 512 and the bay 522. Forexample, the co-packaged DCA 512 is inserted into the backplane 524within the bay 522 such that the memory device 514 and the printedcircuit assembly 504 of the energy storage device 502 commutativelycouple to separate ports of the backplane 524, and the port that maycommunicatively couple to the printed circuit assembly 504 of the energystorage device 502 (e.g. a first port) is positioned above a differentport (e.g. a second port) that may communicatively couple to the memorydevice 514.

In some examples, the bay 522 of the server 520 may be located on afront portion of the server 520. For example, the external accessibilityat the front portion of the server 520 may be a low-temperature thermalenvironment for the co-packaged memory device 514 and energy storagedevice 502 of the DCA 512. In the preceding example, the location of thebay 522 of the front portion of the server 520 allows for easyaccessibility of the DCA 512. Further, the DCA 512 may be serviced (asin, removed or added to the server 520) while the server 520 may bepowered off or dismantled. In such examples, the memory device 514, theprinted circuit assembly 504, and/or the energy storage device 502 maybe serviced when the DCA 512 is removed.

In some examples, the DCA 512 may be hot-plugged or hot swapped into thebay 522, from an exterior portion of the server 520 while the server isoperating. For example, the server 520 may be operating during runtimeand the DCA 512 co-packaged with the energy storage device 502, theprinted circuit assembly 504, and the memory device 514 may beoperational when they are inserted into respective ports of thebackplane 524 of server 520. In the preceding example, the server 520would remain operational during the insertion of the DCA 512 and wouldnot involve powering down and/or interruption of the server 520 runtime.

In some examples the DCA 512 may be decoupled, removed, and/or ejectedfrom the backplane 524 during runtime of the server 520. For example,the server 520 may be operating during runtime and the DCA 512co-packaged with the energy storage device 502, the printed circuitassembly 504, and the memory device 514, may be removed from respectiveports of the backplane 524 of server 520. In the preceding example, theserver 520 would remain operational during the decoupling, removal,and/or ejection of the DCA 512 and would not involve powering downand/or interruption of the server 520 runtime.

In some examples, the printed circuit assembly 504 regulates a pluralityof cells within the energy storage device 502 in response to a powerfailure experienced by the server 520. For example, the printed circuitassembly 504 may detect a power failure of server 520, and in responseto the detected power failure of the server 520 the printed circuitassembly 504, may regulate the usage of the plurality of cells containedin the energy storage device 502 and instruct the energy storage device502 to power the memory device 514 and/or the server 520. In someexamples, the DCA 512 may facilitate the transfer of data stored involatile memory associated with the server 520 to non-volatile memoryassociated with the memory device 514.In another example, the printedcircuit assembly 504 may regulate charging of the energy storage device502.

In some examples, the server 520 may utilize multiple devices similar tothe DCA 512. For example, a server 520 or equivalent host computingdevice may utilize more than one device similar to the DCA 512 asdescribed herein. In this example, the server 520 may utilize the energystorage devices similar to 502 contained in multiple drive carrierassemblies similar to the DCA 512 to power the server 520 in the eventthat the server 520 experiences a power loss.

FIG. 6 is another schematic view of an apparatus including an energystorage device, according to an example. In an example, apparatus 600may include a DCA 606. In another example, the DCA 606 may include aprinted circuit assembly 610. In such examples, the printed circuitassembly 610 may detect a power failure in a system or computing device.In another example, the printed circuit assembly 610 may include pins orfingers located at the rear 608 of the printed circuit assembly 610. Ina further example, the pins or fingers located at the rear 608 of theprinted circuit assembly 610 may be insertable into a socket situated ona backplane. In another example, the printed circuit assembly 610 maycharge an energy storage device 602 via power from the backplane.Further, the printed circuit assembly 610 may control the amount and/orrate of charging of the energy storage device 602. The amount and/orrate of charging may be based on the current power level, age, and/ormaximum power level of the energy storage device 602.

In another example, the DCA 606 may include an energy storage device602. In another example, the energy storage device may be connected tothe printed circuit assembly 610. In another example, an energy storagedevice holder 603 may connect physically and/or electrically to theprinted circuit assembly 610. In such examples, the energy storagedevice holder 603 may retain or hold the energy storage device 602.Further, the energy storage device 602 may physically and/electricallyconnect to the energy storage device holder 603. Thus, through theenergy storage device holder 603, the energy storage device 602 mayconnect to the printed circuit assembly 610. In another example, theenergy storage device 602 may be a battery, capacitor, or supercapacitor. In another example, the DCA 606 may include more than oneenergy storage device 602. In another example, the energy storage device602 may include multiple cells.

In another example, the DCA 606 may be half the width of a storagedevice. In other words, the DCA 606 may be half the width of a smallform factor drive or a large form factor drive. In such examples, twoDCA's 606 may fit into a storage device slot side-by-side. In anotherexample, the DCA may be the same height as the storage device (such as asmall form factor drive or large form factor drive). In anotherexamples, two DCA's 606 may fit into a storage device slot in anover-under configuration (in other words, one DCA 606 in a slotpositioned above another DCA 606, located in a slot below the other DCA606).

In another example, the DCA 606 may include a storage device (notpictured). In an example and as mentioned above, the DCA 606 may be halfthe width of a storage device (such as a small form factor drive or alarge form factor drive). In such examples, the DCA 606 may include amemory device. In such examples, the memory device may be smaller than amemory device included in, for example, a small form factor drive orlarge form factor drive. In such examples, the memory device may be asmaller non-volatile memory device (for example, a M2 drivememory/storage device) to fit in the DCA 606 that is half the width of alarger storage device. In an example, in the event that a computingdevice loses power, the DCA 606 may provide power to the computingdevice. Further, the DCA 606 may provide power for a sufficient lengthof time to allow for data transfer from a volatile memory to anon-volatile memory (whether located on or off the DCA 606).

In another example, the DCA 606 may be insertable into an operatingcomputing device. In other words, the DCA 606 may be hot-pluggable orhot-swappable. In another example, the DCA 606 may be insertable intothe front and/or rear of a computing device (such as a server). In afurther example, the pins or fingers located at the rear 608 of the DCA606 may be formed or configured in such a way as to fit into a standardconnection on a computing devices backplane. In another example, acomputing devices backplane may include additional connections for theDCA 606.

FIGS. 7A and 7B are schematic views of two apparatus in two differentconfigurations, according to an example. As noted above, a DCA 606 maybe situated in a computing device (such as a server) in a variety ofways. For example, and as shown in FIG. 7A, DCA 702 may be inserted inan upper slot of a bay of a computing device (e.g., server). Below thatslot, in another slot, a second DCA 703 may be inserted (stated anotherway, in an over-under configuration). In such examples, the DCA's 702,703 may be half the width of a storage device (such as a small formfactor drive, a large form factor drive, or some other sized storagedevice). In such examples, the computing devices backplane may beconfigured with the connectors to allow for insertion of DCA's 606 andstorage devices.

In another example, the DCA's 606 may be inserted into a computingdevice (e.g., a server) in a side-by-side configuration. As noted abovethe DCA 606 may be half the width of a storage device (such as a smallform factor drive, a large form factor drive, or some other sizedstorage device). In such examples, two DCA's 704, 705 may fitside-by-side into one slot arc bay located at the front and/or rear sideof a computing device (e.g., a server). In such examples, the computingdevices backplane may be configured with the connectors to allow forinsertion of DCA's 606 and storage devices. For example, the backplanemay include two connectors, one for a storage device and the other for aDCA 606 (or two side-by-side connectors for the DCA 606). In suchexamples, the connectors may be located one on top of the other. In suchexamples, the connector for DCA's 606 may be located at a lower portionor higher portion of the backplane for a slot, while the connector forthe storage devices may be located at a higher portion or lower portion(respectively) of the backplane. Thus, if a DCA 606 is inserted into aslot, the rear 608 may line up with a connector on the backplane, whileif a storage device is inserted into a slot, the storage devicesconnection may line up with another connector on the backplane.

FIGS. 8A and 8B are schematic views of a system with two apparatus intwo different configurations, according to an example. In FIG. 8A, oneDCA 802 may be inserted into a slot of a system 800A or computing device(e.g., a server). Further, DCA 803 may be inserted into a slot of asystem 800A located beneath the slot which DCA 802 may be inserted into.FIG. 8A also illustrates several storage devices 806. The storagedevices 806 may be small form factor drives, large form factor drives,or a drive of some other size. Further, the DCA' 802, 803 may be halfthe size of the storage devices 806. In another example, a system 800Amay include slots configured for DCAs 802, 803. In such examples, thebackplane of such a section may include connectors for the DCAs 802,803, while not including connections for storage devices 806 (in otherwords, a portion of the front of the system 800A may be reserved forDCA's or storage devices of a similar form factor).

In another example and as illustrated in FIG. 8B, a DCA 804 may beinserted side-by-side next to another DCA 805 in a system 800B. In suchexamples, the size of the DCA's 804, 805 may allow for two DCA's 804,805 to be inserted into one slot. In another example, when one DCA, forexample DCA 804, is inserted into a slot, but the other slot is leftempty, a blank may be inserted next to the DCA 804. In other words, apiece of plastic with the same or a similar form factor as a DCA (e.g.,804) may be inserted into a blank slot to ensure proper airflowthroughout the system 800B.

FIG. 9 is another block diagram 900 of a system including a drivecarrier assembly, according to an example. In an example, a server 902may include a bay 904. In such examples, the bay 904 may include aplurality of smaller bays or slots. In another example, the plurality ofsmaller bays or slots may be divided by partitions. In another example,a backplane 906 may be positioned at the back of the bay 904. In suchexamples, one side of the backplane 906 facing the front of the server902 may include a plurality of connections corresponding to theplurality of smaller bays or slots. Further, the other side of thebackplane 906 may include a connection to a motherboard or other circuitboard to provide access to DCA's 908 and storage devices. In anotherexample, the backplane 906 may include connections for DCA 908. The DCA908 may include an energy storage device 910 disposed on a printedcircuit assembly 912.

In the foregoing detailed description of the disclosure, reference ismade to the accompanying drawings that form a part hereof, and in whichis shown by way of illustration how examples of the disclosure may bepracticed. These examples are described in sufficient detail to enablethose of ordinary skill in the art to practice the examples of thisdisclosure, and it is to be understood that other examples may beutilized and that process, electrical, and/or structural changes may bemade without departing from the scope of the disclosure. As used herein,designators such as “N”, etc., particularly with respect to referencenumerals in the drawings, indicate that a number of the particularfeature so designated can be included. A “plurality of” is intended torefer to more than one of such things.

What is claimed:
 1. An apparatus comprising: a drive carrier assembly(DCA) including: an energy storage device having at least a portionthereof encased by a housing; and a printed circuit assembly to detect apower failure of a host computing device, wherein the printed circuitassembly has a first portion coupled to the energy storage device and asecond portion coupled to a backplane of the host computing device. 2.The apparatus of claim 1, wherein the DCA is half the width of a smallform factor drive.
 3. The apparatus of claim 1, wherein the DCA is halfthe width of a large form factor drive.
 4. The apparatus of claim 1,wherein the DCA is received by a bay of the host computing device. 5.The apparatus of claim 1, wherein the DCA is coupled to the backplane ofthe host computing device during operation of the host computing device,and wherein the DCA is decoupleable from the backplane during operationof the host computing device.
 6. The apparatus of claim 1, wherein theprinted circuit assembly regulates operation of a cell within the energystorage device in response to detecting a power failure.
 7. Theapparatus of claim 1, wherein the DCA includes a memory device andwherein the energy storage device is to provide power to the memorydevice to facilitate a transfer of data stored in volatile memoryassociated with the host computing device to non-volatile memoryassociated with the memory device.
 8. A drive carrier assembly (DCA),comprising: a plurality of cells within an energy storage device; and aprinted circuit assembly communicatively coupled to the energy storagedevice at a first portion and a server at a second portion, wherein theDCA is half the width of a storage device.
 9. The apparatus of claim 8,wherein the bay is accessible from a front portion of the server. 10.The apparatus of claim 8, wherein two DCAs are insertable into a storagedevice slot side-by-side.
 11. The apparatus of claim 8, wherein two DCAsare insertable into a front portion of the server in an over-underconfiguration.
 12. The apparatus of claim 8, wherein the DCA includes amemory device.
 13. The apparatus of claim 8, wherein the second portionof the printed circuit device couples and uncouples to the server whilethe server is operating.
 14. The apparatus of claim 8, wherein theenergy storage device is partially encased by a housing.
 15. A systemcomprising: a server including: a bay to carriers and drive carrierassemblies (DCAs); an energy storage device encased in a housing,wherein the housing is coupled to a portion of the DCA and wherein theDCA is half the width of the carriers; and a printed circuit assemblycommunicatively coupled to the energy storage device, wherein theprinted circuit assembly regulates a use of the energy storage device inresponse to receiving a signal from the server that the system hasexperienced a power failure.
 16. The system of claim 15, wherein the DCAincludes a memory device.
 17. The system of claim 15, wherein the DCA isinserted into the bay from an exterior portion of the server while theserver is operating.
 18. The system of claim 15, wherein the DCA issecured to a front portion of the server by one or more fasteners. 19.The system of claim 15, wherein the DCA is accessible from a frontportion of the server such that the DCA is removable via the frontportion of the server.
 20. The apparatus of claim 15, wherein the energystorage device is to provide back-up power to the server in response tothe power failure of the server.